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High Glass Transition Temperature Fluorinated ArF Resists for Super Critical CO2 Processing

IP.com Disclosure Number: IPCOM000124186D
Publication Date: 2005-Apr-11
Document File: 2 page(s) / 35K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses maleic anhydride methacrylate (MAMA) and a copolymer of cycloolefin maleic anhudride methacrylate (COMAMA) as a resist in the super critical CO2 process in ArF lithography. Benefits include increasing the glass transition of the resist.

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High Glass Transition Temperature Fluorinated ArF Resists for Super Critical CO2 Processing

Disclosed is a method that uses maleic anhydride methacrylate (MAMA) and a copolymer of cycloolefin maleic anhudride methacrylate (COMAMA) as a resist in the super critical CO2 process in ArF lithography. Benefits include increasing the glass transition of the resist.

Background

Photo resist collapse occurs after the resist structures have been patterned and developed during the drying step, due to capillary forces between structures. The capillary forces are a function of the surface tension of the rinse liquid, the contact angle of the rinse liquid on the resist, and the spacing between resist structures. Photo resist collapse is a problem that will become increasingly severe with each generation, since capillary forces that cause the collapse are inversely proportional to the spacing between structures. 

One solution to the problem is to process the resists under SC CO2. Since SC CO2 is a single phase, there is effectively no surface tension and no capillary forces. Two strategies for processing resist under SC CO2 exist. The first is to pattern, develop, and rinse the resist structures following traditional methods. After this, a second rinse occurs in which the water is replaced by a rinse solution that is compatible with SC CO2, and then dried in SC CO2. The main disadvantage of this strategy is the high process complexity. Another alternative is to directly develop the resist...