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Surface Particle Defect Removal

IP.com Disclosure Number: IPCOM000124189D
Publication Date: 2005-Apr-11
Document File: 3 page(s) / 45K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a tool that removes individual particles from wafers during fabrication. Benefits include reducing wafer defects.

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Surface Particle Defect Removal

Disclosed is a method for a tool that removes individual particles from wafers during fabrication. Benefits include reducing wafer defects.

Background

Current methods measure defect density, location, morphology type, and composition; these methods also include response to trends in these parameters, and develop and establish process sequences to reduce or eliminate certain defect types. There is currently no tool that removes individual particles from wafers during fabrication.

General Description

The disclosed method includes a wafer alignment system and a mechanical arm, which navigates a removal head to locate particles on the surface of a wafer. The wafer is typically planar, with a 20 um height variation and 1 mm across. The wafer is placed on a stage and the particle’s location is determined by a laser scattering inspection tool (an industry standard tool) that is integrated into the particle removal apparatus. The mechanical arm that positions the removal head (see Figure 1) consists of a low-compliance cantilever spring that attaches to the removal head. In order to produce a controlled down-force, the removal head is bonded with a substrate of fixed mass, where the mass m determines the correct down-force. The various removal head configurations are shown in Figure 2.

In the first implementation, the removal head has an adhesive film on its bottom surface. The head contacts with the particle, which adheres to the adhesive film, and is subsequently lifted from the wafer surface. The adhesive surface may be replaced after each particle removal at a station at the edge of the stage. The adhesive is attached to the bottom of the removal head...