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Method for thermal attachment using a phase-change material

IP.com Disclosure Number: IPCOM000124321D
Publication Date: 2005-Apr-15
Document File: 1 page(s) / 34K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for thermal attachment using a phase-change material. Benefits include improved performance.

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Method for thermal attachment using a phase-change material

Disclosed is a method for thermal attachment using a phase-change material. Benefits include improved performance.

Background

              Conventionally, throttling occurs quickly with high power due to short time constants.

Description

              The disclosed method uses phase change material (PCM) located near a high-power device in a notebook to assist the cooling of components that are subjected to power spikes.

              By applying PCM in parallel to the cooling solution, such as by bonding the remote heat exchanger (RHE) to the thermal attach block, the regular performance of the notebook is not impacted. When a power spike occurs, the PCM absorbs energy without raising the temperature beyond a point, at least for a limited amount of time. The phase-change temperature is selected based on the melting that occurs at a junction temperature lower than the junction temperature that causes throttling (see Figure 1).

Advantages

              The disclosed method provides advantages, including:
•             Improved performance due to improving the cooling of components that are subjected to power spikes
•             Improved performance due to preventing throttling at least for a limited amount of time

Fig. 1

Disclosed anonymously