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Venturi Heat Sink With Optional Low Pressure Intake

IP.com Disclosure Number: IPCOM000124603D
Original Publication Date: 2005-Apr-29
Included in the Prior Art Database: 2005-Apr-29
Document File: 8 page(s) / 603K

Publishing Venue

IBM

Abstract

A heat sink formed as a Bernoulli venturi for cooling electronic devices such as a CPU. In addition the heat sink uses the low pressure created by Bernoulli's venturi effect to induct fresh "injectate" air to further aid in cooling.

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Venturi Heat Sink With Optional Low Pressure Intake

     A heat sink is constructed in such a way as to take advantage of the Venturi flow effect as elucidated by Bernoulli. Whereby the fluid (air in this case) speeds up to pass through a restriction and creates a vacuum in the restriction. The invention uses and takes advantage of a venturi section where the velocity of the air has been speeded up. This section is placed within the heat sink and positioned above the hot spot area created by the device beneath the HS that is under thermal load. The invention thus creates a higher velocity section that is a cold spot or sink and draws the heat toward it. The heat is then transferred out of the HS through the rear of the venturi opening. In addition a small hollow area can be created between the venturi section and the hot spot thus creating a pool of air. This pool is then connected via a side port to the venturi for which a second fluid or injectate can be introduced through the front of the HS. The injectate is drawn into the venturi via the low pressure area formed within the venturi as those adapt in the art will recognize. The second fluid can be piped in from the front of the unit before the fan in order to gain access to cooler outside ambient air that the fan may not have. The second injectant thus draws heat out of the HS through the venturi and mixes with the motive fluid and thus is ejected out of the HS through the venturi. Granted, at slow speeds the effec...