Browse Prior Art Database

ICE Breaker

IP.com Disclosure Number: IPCOM000124804D
Published in the IP.com Journal: Volume 5 Issue 6A (2005-06-20)
Included in the Prior Art Database: 2005-Jun-20
Document File: 1 page(s) / 201K

Publishing Venue

Siemens

Related People

Juergen Carstens: CONTACT

Abstract

In the dicing process dice are separated by the use of a saw blade made from diamond corns in a ceramic binding. To achieve a maximum throughput in dicing processes it is necessary to avoid top and bottom chipping, loose chips, random cracking and saw dust seepage. State-of-the-art dicing processes tackle this problem by doing a step-cut. But this also results in low productivity, loose chips and saw dust seepage.

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ICE Breaker

Idea: Ong Meng Tong, Richard, MY-Mal; Loo Shen Fah, MY-Mal; Kang Yong Wee, MY-Mal

In the dicing process dice are separated by the use of a saw blade made from diamond corns in a ceramic binding. To achieve a maximum throughput in dicing processes it is necessary to avoid top and bottom chipping, loose chips, random cracking and saw dust seepage. State-of-the-art dicing processes tackle this problem by doing a step-cut. But this also results in low productivity, loose chips and saw dust seepage.

This idea provides a process with increased productivity as described below. As shown in figure 1, the dice are nearly separated by a single cut so that a certain thickness persists, e.g. 20µm. In order to separate the partial sawn dice the behavior of frozen water is used. The water, which is filled into the sawn groove as shown in fig. 2, expands when it is frozen and separates the dice, shown in fig. 3. Thus it is possible to achieve a higher throughput and less loose chips and saw dust seepage respectively. This method is also suitable for handling thin wafers.

Fig. 1: Side view of the wafer after dicing with predefined rest thickness

Fig. 2: Water (black) filled into the sawn groove

Fig. 3: Expanding frozen water and predefined breaking path of the wafer

© SIEMENS AG 2005 file: ifx_2005J50542.doc page: 1

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