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Functionality and design of a midplane used in double wide Blades

IP.com Disclosure Number: IPCOM000125374D
Original Publication Date: 2005-May-31
Included in the Prior Art Database: 2005-May-31
Document File: 2 page(s) / 77K

Publishing Venue

IBM

Abstract

A midplane in a processor blade is described which acts both as a form-locked connecting element between the ground and the top plate as well as a heat shield , an air splitter and a mounting plate for additional components like IB cards or Graphics cards.

This text was extracted from a PDF file.
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This is the abbreviated version, containing approximately 76% of the total text.

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Functionality and design of a midplane used in double wide Blades Functionality and design of a midplane used in double wide BladesFunctionality and design of a midplane used in double wide Blades Functionality and design of a midplane used in double wide Blades

In the past the airflow within a blade had not been controlled by mounting mechanical elements within the blade. The cooling is only controlled by the outer airflow and the dimensions of the component coolers .

  Such conventional cooling solution has several drawbacks such as: Heating the air during flowing from on side to the other of the blade, which results in a lower cooling capacity in the back region.

No heat shields between the first and the second plane of the blade .

    The midplane shown below solves the drawbacks in such kind that passive coolers as well as an optimized air flow are provided within the blade, making cooling more effective and driving maximum allowed heat dissipation of the components to higher limits. - Air splitter: splitting the air into two flows - Heat shield

    Additionally it fulfills the functionality of a form -locked connecting element between the ground and the top plate as well as a mounting plate for additional components like IB cards or Graphics cards.

    Fig. 1 shows a cross section, which displays the functionality of the midplane as an air splitter and a heat shield preventing the hot air of the CPU coolers to flow through the upper layer. The temperature of the air in t...