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Semiconductor Water Cooled Cold Plate Improvements

IP.com Disclosure Number: IPCOM000125497D
Publication Date: 2005-Jun-03
Document File: 1 page(s) / 22K

Publishing Venue

The IP.com Prior Art Database

Related People

William C. Cray: ATTORNEY

Related Documents

AIEE Summer General Meeting, pp. 511-517, Nov. 1960: OTHER

Abstract

Purpose and Advantage of Invention: Water cooled cold plates have been traditionally used in the Cymer laser SSPPM design to provide cooling of power semiconductor devices. In many applications, the dominant thermal impedance between the cooling water and the semiconductor junction is the interface between the water and the cooling tube in the cold plate. As Cymer applications trend towards higher and higher rep-rates and average power levels, it will become more and more important to optimize the overall thermal management design such that power semiconductor devices are still held well within their operating temperature limits. In order to improve this dominant thermal interface, it is typically desirable to have turbulent water flow through the cooling tube (as compared with laminar flow). One approach to improving this is to add "turbulator" inserts inside the cooling tubes to break up the water flow and create turbulent flow (or more turbulent flow) than previously existed. This same technology has been previously implemented in the heat exchanger assemblies for the Cymer laser chambers where plastic turbulators have been inserted into the cooling tubes of the heat exchanger. Short Description of Invention: In many cases, the tubing for these cold plates is pre-bent and then inserted into machined channels in the cold plate in order to form the coolant path through the cold plate. With this approach, the turbulators could be installed prior to, or during, the tube bending process to specifically locate them in certain areas of the tubing. Once the tubing was bent, it would be assembled into the cold plate in the same manner as before (e.g. press fit and held in place with thermally conductive epoxy, vacuum brazed, etc.). For vacuum brazed designs, the turbulator material would be required to survive the brazing temperature (this might then require the material to be a metal instead of a plastic material). An alternate embodiment could be envisioned for a cold plate manufactured from machined metal plates that were then brazed together to form integral cooling channels. In this case, the same features as the turbulator could be incorporated into one or both of the plates such that the cooling flow was made turbulent.

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Purpose and Advantage of Invention:

Water cooled cold plates have been traditionally used in the Cymer laser SSPPM design to provide cooling of power semiconductor devices.  In many applications, the dominant thermal impedance between the cooling water and the semiconductor junction is the interface between the water and the cooling tube in the cold plate.  As Cymer applications trend towards higher and higher rep-rates and average power levels, it will become more and more important to optimize the overall thermal management design such that power semiconductor devices are still held well within their operating temperature limits.

In order to improve this dominant thermal interface, it is typically desirable to have turbulent water flow through the cooling tube (as compared with laminar flow).  One approach to improving this is to add “turbulator” inserts inside the cooling tubes to break up the water flow and create turbulent flow (or more turbulent flow) than previously existed.  This same technology has been previously implemented in the heat exchanger assemblies for the Cymer laser chambers where plastic turbulators have been inserted into the cooling tubes of the heat exchanger.

Short Description of Invention:

In many cases, the tubing for these cold plates is pre-bent and then inserted into machined channels in the cold plate in order to form the coolant path through the cold plate.  With this approach, the turbulators could be installed prior to, or during,...