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Advanced Assembly Test Chip with Embedded Temperature Sensors and Wireless Data Communication

IP.com Disclosure Number: IPCOM000125764D
Publication Date: 2005-Jun-16
Document File: 3 page(s) / 155K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an advanced assembly test chip (ATC) with embedded temperature sensors and wireless communication, to monitor temperature distributions and transfer data for further analysis. Benefits include accurately measuring temperatures without any disruption to the assembly processes.

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Advanced Assembly Test Chip with Embedded Temperature Sensors and Wireless Data Communication

Disclosed is a method for an advanced assembly test chip (ATC) with embedded temperature sensors and wireless communication, to monitor temperature distributions and transfer data for further analysis. Benefits include accurately measuring temperatures without any disruption to the assembly processes.

Background

It is crucial to monitor die temperatures during package assembly processes (e.g. laser-scribe, thermal compression bonding, epoxy curing, and the flow of mold compound/underfill). In these processes, the yield of the package assembly is very sensitive to the temperature distribution on die, and the temperature profile during the processes. The temperature distribution/profile is one of the critical parameters that must be controlled in the package assembly processes.

Currently, this monitoring is accomplished by estimating the temperature distribution/profile with a numerical model, or by attaching thermocouples to the die surface (see Figure 1). However, this numerical model can inaccurately predict the temperature, due to the complexity of the problem and the assumptions used to simplify the model. The thermocouple approach is not appropriate because the wires can skew the die alignment and die position placement because of the extra force applied by the wires. In addition, the wires can be jammed and broken in the oven and assembly line, and interrupt the flow of underfill or increase the die attach BLT.

General Description

Figure 2 shows the disclosed method within the advanced ATC. Multiple temperature sensors are located at different lo...