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Method for a flexible interconnect

IP.com Disclosure Number: IPCOM000125767D
Publication Date: 2005-Jun-16
Document File: 6 page(s) / 307K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a flexible interconnect. Benefits include improved functionality and improved reliability.

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Method for a flexible interconnect

Disclosed is a method for a flexible interconnect. Benefits include improved functionality and improved reliability.

Background

              Open circuits and fracture-induced opens can occur within individual electrodeposited copper conductor traces on polyimide film interconnects, such as are used on folded-flexible package-on-package semiconductor device components. Additionally, copper trace delamination can occur from polyimide film interconnections.

              When these problems occur, the conventional solution is to scrap the entire packaged component or replace the folded-flex interconnection between the packages.

General description

              The disclosed method produces flexible interconnects by joining individually insulated conductor wires together and subsequently removing selected insulating material from designated individual wires within the interconnect. Insulation materials to be removed include thermoplastic materials, such as polyimide and polytetrafluoroethylene.

Advantages

              The disclosed method provides advantages, including:
•             Improved functionality due to providing flexible interconnections that can be folded and bent

•             Improved functionality due to providing openings in the wire insulator that are suitable for subsequent solder attachment or other conductive interconnects during assembly
•             Improved reliability due to preventing open circuits and fracture-induced opens

•             Improved reliability due to mitigating delamination between the wires and insulators

Detailed description

              The disclosed method produces flexible interconnects by joining individually insulated conductor wires together and subsequently removing selected insulating material from designated individual wires within the interconnect. Materials to be removed include thermoplastic materials, such as polyimide and polytetrafluoroethylene.

              Individual insulated wires are wound around a mandrel or nested next to each other (see Figure 1).

              The individual wires are joined using a combination of heat and pressure (see Figure 2).

              The selective removal of the insulating material from designated locations on individual wires pro...