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Method for variable out-of-plane CTE adjustment in electronic packages

IP.com Disclosure Number: IPCOM000125769D
Publication Date: 2005-Jun-16
Document File: 2 page(s) / 52K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for variable out-of-plane coefficient of thermal expansion (CTE) adjustment in electronic packages. Benefits include improved functionality, improved performance, and improved reliability.

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Method for variable out-of-plane CTE adjustment in electronic packages

Disclosed is a method for variable out-of-plane coefficient of thermal expansion (CTE) adjustment in electronic packages. Benefits include improved functionality, improved performance, and improved reliability.

Background

      A major issue for stacked chip-scale packaging (SCSP) involves stress accumulated from the die-attach assembly processes and the standoffs used to separate similar size die.

      In stacked configurations using similar sized die, a stand-off made of an inactive piece of silicon, paste, or composite material separates the like die. An adhesive is typically applied to the standoff. The conventional solution addresses in-plane stress but tends to under-perform in the out-of-plane direction.

General description

      The disclosed method includes a composite spacer that enables changes to the out-of plane CTE, enabling the tuning of the inherent die stack and package stress. The method enables the stress in die stacks to be predicted and tuned in configurations that require a standoff.

      By using a composite spacer material with a through-hole matrix, a standoff can be implemented that results in a predictable out-of-plane CTE. The method enables a solution that can be modified to meet CTE requirements.

              The key elements of the disclosed method include:

•             Composite spacer design

•             Package stress

•             Tuned out-of-plane CTE

Advantages

              The disclosed method provides advantages, including:
•             Improved...