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FUNCTIONAL PART FOR A FORMING PURPOSE

IP.com Disclosure Number: IPCOM000126821D
Publication Date: 2005-Aug-12
Document File: 2 page(s) / 1M

Publishing Venue

The IP.com Prior Art Database

Abstract

Using the Radio Frequency shield as a mould for potting material and epoxy adhesives When purchasing IT products that contain security functions, United States government agencies may only buy products that have been validated to FIPS 140-2, Security Requirements for Cryptographic Modules. Individual agencies may require that the products meet a particular Security Level of the possible four consecutive Security Levels in FIPS 140-2 that increase in security requirements. At Security Level 3, there are physical security requirements placed on the IT products with the intent of detecting and preventing attempts to physically access the security-relevant hardware. One possible solution to satisfy the government’s physical security requirements is to encapsulate the security-relevant hardware into a solid potting material. To implement this solution on a handheld communication device, the processor, flash RAM, and SRAM integrated circuits would all need to be encapsulated. Since potting material is initially in a liquid state, correct containment and application of the potting material is necessary to ensure that the Security Level 3 physical security requirements are satisfied, and that the handheld device is not rendered inoperable. For certain model of handheld communication devices, the Radio Frequency (RF) shield is designed to compartmentalize the integrated circuits on the printed circuit board. The processor, flash RAM, and SRAM integrated circuits are compartmentalized by the RF shield. By using an existing hole in the RF shield, potting material can be injected into the compartment containing the processor and the other components. This way, the RF shield design prevents the potting material from flowing into other hardware compartments.

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FUNCTIONAL PART FOR A FORMING PURPOSE

Using the Radio Frequency shield as a mould for potting material and epoxy adhesives

Disclosed Anonymously

When purchasing IT products that contain security functions, United States government agencies may only buy products that have been validated to FIPS 140-2, Security Requirements for Cryptographic Modules.  Individual agencies may require that the products meet a particular Security Level of the possible four consecutive Security Levels in FIPS 140-2 that increase in security requirements.  At Security Level 3, there are physical security requirements placed on the IT products with the intent of detecting and preventing attempts to physically access the security-relevant hardware.

One possible solution to satisfy the government’s physical security requirements is to encapsulate the security-relevant hardware into a solid potting material.  To implement this solution on a handheld communication device, the processor, flash RAM, and SRAM integrated circuits would all need to be encapsulated.  Since potting material is initially in a liquid state, correct containment and application of the potting material is necessary to ensure that the Security Level 3 physical security requirements are satisfied, and that the handheld device is not rendered inoperable. 

For certain model of handheld communication devices, the Radio Frequency (RF) shield is designed to compartmentalize the integrated circuits on the printed circuit board.  Th...