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Method for a four-corner, folded, flexible CSP with capacitors inside the mold cap

IP.com Disclosure Number: IPCOM000126990D
Publication Date: 2005-Aug-16
Document File: 3 page(s) / 88K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a four-corner, folded, flexible (flex) chip scale package (CSP) with capacitors inside the mold cap. Benefits include improved functionality, improved performance, improved electrical performance, and improved thermal performance.

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Method for a four-corner, folded, flexible CSP with capacitors inside the mold cap

Disclosed is a method for a four-corner, folded, flexible (flex) chip scale package (CSP) with capacitors inside the mold cap. Benefits include improved functionality, improved performance, improved electrical performance, and improved thermal performance.

Background

      Industry trends have created requirements for smaller form factors and longer wirebond lengths. As a result, challenges exist with wire-bond clearance and die overhang. In response, dice are stacked, which leads to requirements in thermal management.

      To meet these requirements and challenges, several different types of conventional folded (flex) packages are in use. Many have one package for a logic die on a substrate. A flex substrate or tape is folded and another package is stacked on top. Capacitors or inductors can be embedded in the substrate or placed on a tape. Alternatively, capacitors or inductors can be mounted side by side with the logic or memory package. These solutions result in package height increases (see Figure 1).

      A solution is required that accommodates smaller form factors.

Description

      The disclosed method is one die in the middle of crossed-shaped flex substrate with bond pads on the ends (see Figure 2).

              The key elements of the disclosed method include:

•             One die with wire-bond pads around the outer perimeter of the die

•             Flex substrate with a cross shape and bond pads around the outer perimeter

•             Cross-shaped flex substrate w...