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Method for a wafer-level assembly process of optoelectronic heterogenous structures on a silicon IC

IP.com Disclosure Number: IPCOM000127680D
Publication Date: 2005-Sep-08
Document File: 3 page(s) / 101K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a wafer-level assembly process of optoelectronic heterogenous structures on a silicon integrated circuit (IC). Benefits include improved functionality.

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Method for a wafer-level assembly process of optoelectronic heterogenous structures on a silicon IC

Disclosed is a method for a wafer-level assembly process of optoelectronic heterogenous structures on a silicon integrated circuit (IC). Benefits include improved functionality.

Background

              Hybrid integration is required for optoelectronic heterogenous structures (hetero-structures) grown on and released from III-V compound wafers with conventional silicon (Si) ICs on wafers. An important criterion for successful hybrid integration is to obtain the high-yield transfer of optoelectronic hetero-structures from a III-V wafer to a silicon wafer. When the III-V hetero-structures are transferred to a Si IC wafer, subsequent processing is performed as if only silicon is involved. The complete hybrid wafer can be utilized for optical interconnection.

              Conventionally, a manual or statistical assembly process is performed using the following steps (see Figure 1):

1.   Formation of optoelectronic hetero-structures, such as VCSEL, on a III-V wafer

2.   Release of the structures

3.   Collection of the structure pills with a distinct top and bottom for each pill

4.   Statistical or manual transfer of the pills (patterned heterogeneous structures) into a recess on a Si wafer

 

      A manual assembly process requires the use of micro-tweezers or micropipettes to pickup optoelectronic structures and place them into a recess on a Si IC wafer. Statistical methods require the repetition of an assembly process to obtain higher assembly yield. None of the existing methods are high-yield processes. They are not suitable for high volume manufacturing.

Description

              The...