Browse Prior Art Database

Repair of Imprint Lithography Templates Prior to Relief Etching

IP.com Disclosure Number: IPCOM000129171D
Original Publication Date: 2005-Sep-29
Included in the Prior Art Database: 2005-Sep-29
Document File: 5 page(s) / 2M

Publishing Venue

Motorola

Related People

S. R. Young: AUTHOR [+2]

Abstract

Described is the concept of repairing Imprint Lithography Templates during the manufacturing process. The proposed development is to insert a repair strategy after pattern etching the template hardmask (typically chrome) and prior to relief etching the base template (typically quartz). While this invention was originally conceived in the context of repairing transparent Step and Flash Imprint Lithography (S FIL) templates, the concept could also be applicable to some of the many other variations of templates fabricated for imprint lithography. The bases of this invention can easily be integrated into existing mask manufacturing facilities and allows for repairs to be performed on both opaque and clear defects which will ultimately eliminate unnecessary scrap cost.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 43% of the total text.

Repair of Imprint Lithography Templates Prior to Relief Etching

S. R. Young, W. J. Dauksher

Abstract

Described is the concept of repairing Imprint Lithography Templates during the manufacturing process.  The proposed development is to insert a repair strategy after pattern etching the template hardmask (typically chrome) and prior to relief etching the base template (typically quartz).  While this invention was originally conceived in the context of repairing transparent Step and Flash Imprint Lithography (S‑FIL) templates, the concept could also be applicable to some of the many other variations of templates fabricated for imprint lithography.  The bases of this invention can easily be integrated into existing mask manufacturing facilities and allows for repairs to be performed on both opaque and clear defects which will ultimately eliminate unnecessary scrap cost. 

Introduction

Step and Flash Imprint Lithography (S-FIL) is currently a viable contender on the International Technology Roadmap for Semiconductors (ITRS) for the Next Generation Lithography (NGL)1.  S-FIL is an attractive low-cost technology for printing sub-100 nm geometries by eliminating the need for complex and expensive optics and light sources.  Patterning is performed by utilizing an optically transparent, 1:1 template which is pressed with low pressure directly onto a photo-sensitive organic‑based monomer coating.  After a through-the-template exposure step, the cured image is used as a masking layer for subsequent pattern transfer.  For S-FIL or any imprint lithography to become viable for manufacturing, certain elements of the infrastructure must be present. In particular, these elements include: fast and precise Electron Beam (E-beam) pattern writing; ability to inspect; and a methodology to repair.

Currently repair of Imprint Lithography has only been demonstrated on completed S-FIL templates utilizing nanomachining Atomic Force Microscopy (AFM) methods2.  This past AFM-based investigation successfully demonstrated machining away opaque defects on completed templates. These repairs were limited by the size and geometry of the stylus tip being employed. Given current state-of-the art for template repair, templates with clear defects would have to be scrapped out and would require manufacturing a new template.

Method


To further extend the previous work, repairs can be conducted strategically within the template fabrication sequence. S-FIL templates are typically fabricated on 6 in. x 6 in x 0.25 in (6025) quartz plates which is compatible with standard mask manufacturing facilities.  One fabrication methodology involves metallizing the plate with a thin layer of chrome then patterning with E‑beam lithography.  The patterned chrome is then used as a hardmask to dry etch a 100 nm (typical) relief into the quartz before being stripped off (Figure 1). 

Figure 1. Conventional S-FIL template fabrication scheme

This invention inserts a repair strategy after p...