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New air flapper to keep pressure impedance and for device cooling in an enclosure chassis

IP.com Disclosure Number: IPCOM000129730D
Original Publication Date: 2005-Oct-07
Included in the Prior Art Database: 2005-Oct-07
Document File: 2 page(s) / 81K

Publishing Venue

IBM

Abstract

New air flapper assembly to enhance air cooling effectiveness by its air flow deflection design, in addition, to have the conventional function of keeping airflow impedance across the slots in a system enclosure.

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New air flapper to keep pressure impedance and for device cooling in an enclosure chassis

New air flapper assembly to enhance air cooling effectiveness by its air flow deflection design, in addition, to have the conventional function of keeping airflow impedance across the slots in a system enclosure.

In a system enclosure having multiple slots to accommodate individual devices/trays/cards, all of these slots are not occupied in use by them at any time. Cooling air must flow through the slots into the chassis, and the conventional air flapper assembly has the function of controlling airflow impedance by blocking or reducing airflow in case any of the slots are unoccupied or kept empty due to system configuration change or maintenance operation.

The new air flapper assembly (Fig. 1) has the additional function, and that is to enhance air cooling effectiveness by its airflow-deflecting design with keeping airflow impedance across the slots in a system enclosure (Fig. 2). Each air flapper plate (1) has a airflow-deflecting (or guiding) face so that it can lead cooling airflow toward devices/trays/cards in adjacent slots from an empty slot.

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Tray insertion direction

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Tray insertion direction

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(1) Flapper (4) Chassis
(2) Base (5) Flapper Assembly

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(3) Spring (6) Tray (Device or Card)

Fig. 1 Flapper Assembly Fig. 2 Enclosure Structure

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Air f...