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Integrated Heat Spreader Assembly for Stacked or Double Sided Integrated Circuits

IP.com Disclosure Number: IPCOM000130522D
Publication Date: 2005-Oct-25
Document File: 4 page(s) / 221K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a micro-electronic package with an integrated heat spreader (IHS) for stacked/double sided devices. Benefits include increasing the thermal envelope for stacked and double sided devices.

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Integrated Heat Spreader Assembly for Stacked or Double Sided Integrated Circuits

Disclosed is a method for a micro-electronic package with an integrated heat spreader (IHS) for stacked/double sided devices. Benefits include increasing the thermal envelope for stacked and double sided devices.

Background

Thermal dissipation is an issue in packages containing stacked and/or double sided devices. Currently, the present technology has limitations on total product power that can be dissipated (see Figure 1). Products exceeding this limit are forced to use alternative packaging form factors.

General Description

The concept modifies existing package molds by allowing a compliant material to contact the top of the device surface. Once this contact is established, the epoxy compound can be injection molded to encase the wire bonds and other portions of the devices. Contact with the device is created by pressurizing an elastomer bladder (see Figure 2) so that the portions of the bladder that are over the perforated mold regions expand and establish contact. Alternatively, a compliant material, such as an elastomer, can be placed on the device or attached to the mold so that contact is made with the desired region of the device when the mold fully engages the package (see Figure 7).

The injection molding is accomplished using positive or negative pressures to dispense the epoxy into the mold cavity. The pressures must set be so that the epoxy is not forced between the bladder or compl...