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Polyhedral Oligomeric Silsesquioxane Application in Substrate Core Material to Improve Thermal Mechanical Properties

IP.com Disclosure Number: IPCOM000130524D
Publication Date: 2005-Oct-25
Document File: 3 page(s) / 229K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that applies a Polyhedral Oligomeric Silsesquioxane (POSS)-polymer nano-composites material into the substrate core material (CM) to improve thermal mechanical properties. Benefits include increasing Tg, decreasing the coefficient of thermal expansion (CTE), and improving thermal stability.

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Polyhedral Oligomeric Silsesquioxane Application in Substrate Core Material to Improve Thermal Mechanical Properties

Disclosed is a method that applies a Polyhedral Oligomeric Silsesquioxane (POSS)-polymer nano-composites material into the substrate core material (CM) to improve thermal mechanical properties. Benefits include increasing Tg, decreasing the coefficient of thermal expansion (CTE), and improving thermal stability.

Background

Substrate CM and insulation layers require polymers that possess lower CTE and higher glass transition temperatures. They also require an enhanced thermal and mechanical strength to avoid high stress, delamination, and warpage issues.

Currently, substrate CM is polymer resin-based (e.g. polyimide [PI], Bismalimides Triazine [BT], Poly Phenylene Ether [PPE]), and has a much higher CTE than the die. High CTE can create serious substrate warpage, leading to some barriers in the assembly process. Package CTE mismatch triggers more internal stresses, resulting in package failures.

To address these problems, low CTE compounds are blended with current polymer materials to decrease the entire composite CTE; however, this does not lead to a satisfactory reduction in CTE. New low-CTE materials have been synthesized, but they do not meet requirements or parameters for mechanical strength and thermal stability.

General Description

The disclosed method’s POSS structure is composed of a rigid cubic silica core with nano-pores (see Figure 1). The POSS/po...