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Method for server chassis precooling

IP.com Disclosure Number: IPCOM000130561D
Publication Date: 2005-Oct-26
Document File: 3 page(s) / 947K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for server chassis precooling. Benefits include improved functionality, reliability, improved performance, and improved cost effectiveness.

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Method for server chassis precooling

Disclosed is a method for server chassis precooling. Benefits include improved functionality, reliability, improved performance, and improved cost effectiveness.

Background

              When forced air convection cooling limits are exceeded, printed circuit boards (PCBs) can fail.

General description

              The disclosed method is server chassis precooling. It isolates the cooling solution from the circuit boards.

              Calculations indicate that the incoming ambient temperature can be reduced by about 13˚C, reducing component temperatures correspondingly. Enhanced cooling is accomplished while avoiding board thermal redesigns and delaying or avoiding the requirement for liquid cooling and its associated costs and risks. Because this approach separates the circuit boards from the liquid cooling path, card-cage leakage is avoided. The costs of the pumps and heat exchangers of standard liquid cooling systems is also avoided. The cost of miniature liquid disconnects per board is replaced by one standard disconnect per chassis.

Advantages

Some implementations of the disclosed structure and method provide one or more of the following advantages:

              The disclosed method provides advantages, including:

•             Improved functionality due to providing server chassis precooling

•             Improved functionality due to cards being inserted and withdrawn without opening and closing the liquid cooling loop

•             Improved reliability due to preventing the occurrence of liquid leaks in the card cage                               
•             Improved performance due to maximizing the use of card surface area for electronic components because space is not required for cooling

•             Improved cost effectiveness due to using a low parts count and not requiring pumps or heat exchangers

•             Improved cost effectiveness due to not requiring interconnects for liquid cooling delivery to the boards

•             Improved cost effectiveness due to not requiring board redesig...