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Use of integrated metrology in the TEL track for reworking wafer, which are outside of spec

IP.com Disclosure Number: IPCOM000131056D
Published in the IP.com Journal: Volume 5 Issue 11B (2005-12-10)
Included in the Prior Art Database: 2005-Dec-10
Document File: 1 page(s) / 17K

Publishing Venue

Siemens

Related People

Juergen Carstens: CONTACT

Abstract

Currently the exposure, measurement and rework of wafers, whose CD (Contact-to-Diffusion) is out of specification (spec), take place in different tools. Thus the cycle time of the whole lot is limited by separate step times, which are necessary for these treatments. In current lithography (litho) processes in the wafer production the rework time for precursor wafers is around five hours. The modern TEL (Tokyo Electron Limited) tracks are equipped with inline CD measurement. So the following rework inside of the track is a mandatory step for consequently acceleration of lot processing.

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Use of integrated metrology in the TEL track for reworking wafer, which are outside of spec

Idea: Dr. Uta Mierau, DE-Dresden; Woong-Jae Chung, DE- Dresden; Susanne Volkland, DE-

Dresden

Currently the exposure, measurement and rework of wafers, whose CD (Contact-to-Diffusion) is out of specification (spec), take place in different tools. Thus the cycle time of the whole lot is limited by separate step times, which are necessary for these treatments. In current lithography (litho) processes in the wafer production the rework time for precursor wafers is around five hours. The modern TEL (Tokyo Electron Limited) tracks are equipped with inline CD measurement. So the following rework inside of the track is a mandatory step for consequently acceleration of lot processing.

The idea describes a process for reworking wafers inside of TEL track. When the inline measured CD is out of spec, the wafer will be taken out from the remaining lot, restarted and reworked in a special equipped coater unit, which is equipped with solvent supply. The resist mask can be removed by solvent rinse. Therefor, in very fast matter, the incorrect wafer of a productive lot will be cleaned. It should be possible to shorten the cycle time of the lot and speed up the lot processing.

This is possible only for positive tone resists, which are coated on HMDS (Hexamethyldisilazane). If the resist process contains organic antireflective coating (BARC - Bottom Anti-Reflective Coating) underneath, th...