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Method for using magnets for semiconductor scrubbing

IP.com Disclosure Number: IPCOM000131683D
Publication Date: 2005-Nov-14
Document File: 2 page(s) / 50K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for using magnets for semiconductor scrubbing. Benefits include improved functionality and improved performance.

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Method for using magnets for semiconductor scrubbing

Disclosed is a method for using magnets for semiconductor scrubbing. Benefits include improved functionality and improved performance.

Background

              The conventional solution uses deionized (DI) water to rinse away particles in a rinse cup with a scrubber brush.

Description

              The disclosed method uses magnets for two semiconductor scrubbing improvements. One creates a magnetic field for cleaning wafers during processing. The second increases brush life in scrubber tools.

Magnetic field

              The disclosed method creates a magnetic field using an electromagnet suspended over a wafer during semiconductor processing. The field length is controlled through an electrical source. The polarity is the opposite of the surface particles on the wafer. They are attracted to the electromagnet and cleaned off the wafer. The wafer rotates while the electromagnet passes over the wafer from the edge to the center. The cleaning is performed before critical processes, such as chemical vapor deposition (see Figure 1).

Increased brush life

              The disclosed method cleans scrubber tool brushes, extending brush life and ensuring the back side of the wafer is clean before lithography. A magnetic field is created using a magnet at the bottom of a scrubber cup and an electromagnet behind the scrubber brush. The magnetic field is the opposite polarity of the charged particles collected on the scrubber brush. The bottom m...