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Balancing Incidental Gas Flow Through a Fixed-Hole Orifice Plate

IP.com Disclosure Number: IPCOM000132312D
Publication Date: 2005-Dec-07
Document File: 2 page(s) / 115K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an apparatus that balances and directs the total volumetric flow rate (Q) across a fixed-hole orifice plate. Benefits include a solution that reduces costs and only requires one simple part to be modified.

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Balancing Incidental Gas Flow Through a Fixed-Hole Orifice Plate

Disclosed is a method for an apparatus that balances and directs the total volumetric flow rate (Q) across a fixed-hole orifice plate. Benefits include a solution that reduces costs and only requires one simple part to be modified.

Background

Currently, there is an undesirable leading-edge (of flow) on the film deposition profile. To address this, the process deposits thinner films to reduce the magnitude of the film range/WIW variations, and/or redesigns the entire reactor injection hardware to diffuse the flow.

General Description

The current reactor inlet flow plenum design causes the gas at the center of the flow plate to have a higher velocity, thereby delivering more process gas at the center and causing a thicker film deposition at the front of the wafer.  The disclosed method’s flow plate compensates for this effect, and rebalances the velocity profile to ensure that equal amounts of process gas are delivered across the wafer; this produces a more uniform film deposition. 

The disclosed method uses modified hole diameters and hole locations on the gas inlet plate to tune the gas flow for optimal film deposition. Figure 2 shows that the center hole diameters decrease in the center of the inlet plate in order to balance out the gas flow across the chamber.

Advantages

The following are advantages of the disclosed method:

§         Requires only one simple part to be modified

§         Lowers process costs

§         Reduces...