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Vented Lid for RF Semiconductor Packages

IP.com Disclosure Number: IPCOM000132333D
Publication Date: 2005-Dec-07
Document File: 1 page(s) / 8K

Publishing Venue

The IP.com Prior Art Database

Abstract

Present open cavity RF packages are only liquid tight and not hermetic. This allows the slow diffusion of moisture into and out of the package until equilibrium is reached with the outside environment. Rapid environmental temperature changes can cause condensation inside the package that leads to corrosion of the package and die under bias conditions.

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Vented Lid for RF Semiconductor Packages

Present open cavity RF packages are only liquid tight and not hermetic.  This allows the slow diffusion of moisture into and out of the package until equilibrium is reached with the outside environment.  Rapid environmental temperature changes can cause condensation inside the package that leads to corrosion of the package and die under bias conditions.

            One approach to solving this problem is to use truly hermetic packages which are very expensive, but do eliminate the corrosion problems.  This approach prevents liquid water from being present inside the package which is necessary for electrolytic corrosion to occur.  A second approach to solving this problem that has had limited success is to change the materials of the open cavity RF packages to make the packages more robust against corrosion.  A third approach is to simply vent the package by making a small opening in it.  This approach eliminates the corrosion problem because condensation cannot occur inside the package because the free exchange of the atmosphere between the package and environment keeps the water vapor at equilibrium.  This third approach is a very simple solution that has one very big drawback.  The package is no longer liquid tight.  The opening could allow solder flux or cleaning agents used in subsequent processing during the assembly of the package to enter into the package.  This could result in more severe problems than cor...