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Method for an FBDIMM heat spreader

IP.com Disclosure Number: IPCOM000132594D
Publication Date: 2005-Dec-23
Document File: 2 page(s) / 59K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a fully buffered dual in-line memory module (FBDIMM) heat spreader. Benefits include improved functionality, improved performance, improved thermal performance, and improved reliability.

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Method for an FBDIMM heat spreader

Disclosed is a method for a fully buffered dual in-line memory module (FBDIMM) heat spreader. Benefits include improved functionality, improved performance, improved thermal performance, and improved reliability.

Background

              Conventional FBDIMM heat spreader designs do not have indentations to accommodate the different heights of the dynamic random access memory (DRAM) modules and the memory controller. As a result, air gaps reduce the cooling capability of the spreader, which lowers system performance. Additionally, conventional designs do not use multifingered springs to apply mechanical force on the DRAMs and memory controller.

Description

              The disclosed method is an FBDIMM heat spreader comprised of two copper heat spreaders and multifingered springs. One copper heat spreader cools the front side of the FBDIMM. The other heat spreader cools the back side. Both spreaders have indentations to accommodate different DRAM and memory controller heights.

              The multifingered springs apply mechanical loading on the heat spreaders. They are placed by sliding the springs over the top edge of the FBDIMM to clamp the heat spreaders against the assembly (see Figures 1 and 2).

              The back side of the heat spreader contains indentations for retaining the DRAMs.

              The multifingered springs generate a uniform pressure over the DRAMs and the memory controller. When the multifingered springs are used in combina...