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Method for an off-center AMB heat spreader for use with FBDIMMs

IP.com Disclosure Number: IPCOM000132595D
Publication Date: 2005-Dec-23
Document File: 2 page(s) / 225K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an off-center advanced memory buffer (AMB) heat spreader for use with fully buffered dual in-line memory modules (FBDIMMs). Benefits include improved functionality, improved performance, improved thermal performance, and improved design flexibility.

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Method for an off-center AMB heat spreader for use with FBDIMMs

Disclosed is a method for an off-center advanced memory buffer (AMB) heat spreader for use with fully buffered dual in-line memory modules (FBDIMMs). Benefits include improved functionality, improved performance, improved thermal performance, and improved design flexibility.

Background

              Conventionally, AMB heat spreaders are approximately the same size as the AMB package. However, simulation indicates the conventional design is insufficient to cool the AMB due to its increased power.

              FBDIMM cooling is a bottleneck in the improvement of overall system performance.

Description

              The disclosed method is an off-center AMB heat spreader for use with FBDIMMs. The method accommodates the increase in AMB power.

              The method is comprised an off-center AMB heat spreader and retention clips. The heat spreader is placed in contact with the AMB and secured to the FBDIMM board using the retention clips. The heat spreader provides a conduction path for the heat dissipated by the AMB die. When the heat is conducted upward into the heat spreader, the extended surface area of the heat spreader enables forced air convection to efficiently remove the heat. The heat spreader extends in the direction of the incoming air to increase the efficiency of the convection by minimizing the effect of preheating (see Figure 1).

              A side view of the disclosed method illustrates a gap between the h...