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Method for a clipless FBDIMM heat spreader

IP.com Disclosure Number: IPCOM000132596D
Publication Date: 2005-Dec-23
Document File: 3 page(s) / 334K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a clipless fully buffered - dual in-line memory module (FBDIMM) heatspreader. Benefits include improved functionality, improved performance, improved thermal performance, improved throughput, and improved cost effectiveness.

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Method for a clipless FBDIMM heat spreader

Disclosed is a method for a clipless fully buffered - dual in-line memory module (FBDIMM) heatspreader. Benefits include improved functionality, improved performance, improved thermal performance, improved throughput, and improved cost effectiveness.

Background

              FBDIMM cooling is a bottleneck in the improvement of overall system performance.

              Conventionally, a heat spreader is comprised of 3-4 parts.

             

Description

              The disclosed method contains a front-side heat spreader for cooling the advanced memory buffer (AMB) and a back-side heat spreader for the dynamic random access memory (DRAM) modules. The front-side heat spreader is placed in contact with the AMB, increasing the overall cooling surface area. Similarly, the back-side heat spreader is placed in contact with the back-side DRAMs. The heat spreaders maintain reduced temperatures for the AMB and DRAMs when adequate system flow is provided (see Figure 1).

              The method includes FBDIMM latching features. When the front-side latching feature (silver piece) is pushed into the latching feature on the back (brown) side, the two heat spreaders are attached to the FBDIMM (see Figure 2).

              Thermal interface material (TIM) performance is generated by the deflection of the heat spreader (see Figure 3).

Advantages

Some implementations of the disclosed structure and method provide one or more of the following advantages:

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