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Method for an AMB-only heat spreader

IP.com Disclosure Number: IPCOM000132599D
Publication Date: 2005-Dec-23
Document File: 2 page(s) / 408K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an advanced memory buffer-only (AMB-only) heat spreader. Benefits include improved functionality, improved performance, improved thermal performance, improved reliability, and improved throughput.

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Method for an AMB-only heat spreader

Disclosed is a method for an advanced memory buffer-only (AMB-only) heat spreader. Benefits include improved functionality, improved performance, improved thermal performance, improved reliability, and improved throughput.

Background

              Conventionally, fully buffered dual in-line memory module (FBDIMM) cooling is a bottleneck in the improvement of the overall system performance.

              The conventional heat spreader has a wire clip that is attached to the FBDIMM. However, the clip is difficult to attach (see Figure 1).

Description

              The disclosed method is an AMB-only heat spreader. The method applies to applications with FBDIMMs.

              The key elements of the disclosed method include:

•             Copper heat spreader for the AMB

•             Steel clip for securing the heat spreader

              The heat spreader has two bent protrusions on the top and bottom edges. The clip is attached by sliding it over the top edge of the memory stick, which provides ease of installation and increased throughput. The clip secures the heat spreader to the AMB by providing a preset compressive load. The protrusions are key-in features that interface with an existing hole and notch in the FBDIMM. The two protrusions are load-bearing features for shock events that occur in the heat-spreader plane. During out-of-plane shocks, the clip prevents the heat spreader from detaching from the AMB (see Figure 2).

              Due to the relat...