Browse Prior Art Database

Gold Wire bond Terminals

IP.com Disclosure Number: IPCOM000132638D
Publication Date: 2005-Dec-28
Document File: 2 page(s) / 193K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for gold wire terminals that are wire bonded to either the bond pad or package substrate, enabling multiple wire bond tack points. Benefits include maintaining a small die size and increasing the die stacking flexibility.

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Gold Wire bond Terminals

Disclosed is a method for gold wire terminals that are wire bonded to either the bond pad or package substrate, enabling multiple wire bond tack points. Benefits include maintaining a small die size and increasing the die stacking flexibility.

Background

Currently, there are complexities associated with multiple die stacking configurations and the number of wire bond pads on a substrate; the wire bond pads accommodate the power and ground connections needed for multiple stacked die, and the wire bond die-to-die connections between them.

To address these complexities, extra bond-fingers are placed on a substrate to allow individual die wire bond tacking between each die and substrate (see Figure 1). However, this increases the bond finger count, which increases the routing complexity that requires higher density substrate design rules.

General Description

The disclosed method uses gold wire terminals wire bonded to either the bond pad or package substrate, enabling multiple wire bond tack points (see Figure 2). The following are the steps for making the disclosed method:

1.      The wire bond terminal is constructed separately.  This can be done with a variety of methods.

2.      Standard packaging techniques are applied to the first piece of silicon to substrate

3.      Wire bond terminals are placed on to top of first silicon

4.      The terminals are connected using existing bonding techniques (e.g. solder, adhesive, etc.)

5.      Additional die are stacked

6.      Wire bondin...