Browse Prior Art Database

Enabling Power Supply in Package on Multi-Layer Flex Packages

IP.com Disclosure Number: IPCOM000132639D
Publication Date: 2005-Dec-28
Document File: 2 page(s) / 175K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for placing a power supply in package (PSIP) on a multi-layer flex substrate package. Benefits include improved routing densities with flex substrates.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 79% of the total text.

Enabling Power Supply in Package on Multi-Layer Flex Packages

Disclosed is a method for placing a power supply in package (PSIP) on a multi-layer flex substrate package. Benefits include improved routing densities with flex substrates.

Background

Next generation Flash packaging may require that flex substrates and PSIP be combined to create a package that can compete in the market. The PSIP may require surface-mounted parts, offset silicon, high voltage traces, and over-molding, all of which have never been done before on a multi-layer flex substrate.

This issue is currently addressed by using a rigid (FR-4 type) substrate with surface mounted parts.  Another scenario (see Figure 1) uses a flexible substrate for the semiconductor package that could also be used to include power supply in package. However, several challenges with over-molding and offset silicon occur, and similar challenges are expected when trying to achieve these goals when using multi-layer flex substrates. 

General Description

The disclosed method places a PSIP on a multi-layer flex substrate package (see Figure 2). The disclosed method offsets the die center away from the ball grid array center in flex packaging, to enable the placement of passive components while maintaining package size. The following are the process steps for the disclosed method:

1.      Manufacture a multi-layer, polyamide-based substrate using conventional techniques.

2.      Apply silicon to the package using offset die placement fiducial...