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Spring-Loaded Contact Mechanism for the Land Grid Array Socket

IP.com Disclosure Number: IPCOM000132643D
Publication Date: 2005-Dec-28
Document File: 3 page(s) / 323K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a spring-loaded termination for the land grid array (LGA) socket, instead of the current protruding pins. Benefits include a solution that can withstand improper handling and continuous usage without losing its contact force.

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Spring-Loaded Contact Mechanism for the Land Grid Array Socket

Disclosed is a method that uses a spring-loaded termination for the land grid array (LGA) socket, instead of the current protruding pins. Benefits include a solution that can withstand improper handling and continuous usage without losing its contact force.

Background

Current contacts (i.e. the interface between the socket and the LGA interposer/processor) are thin and exposed to the environment, and can be easily damaged by users. Damaged pins can result in open or short contacts that pose a reliability risk to the boards; this indirectly impacts the reputation of the processor, as the failures are mistakenly seen as a processor failure. At the present moment, this accounts for about 1,000DPM of the failures seen at ODMs and customers (see Figure 1).

The current design uses a copper pin (see Figure 2) as the termination of the sockets; this design provides good electrical connectivity between the parts, but because the pins are thin and unprotected, they are easily bent. Damage is currently controlled by proper handling methods and additional visual inspections.

General Description

In the disclosed method, the upper termination of the contact is modified to a spring-loaded vertical contact design (with the same metal and plating properties). The contact is mounted within the housing and is protected on all corners to ensure that the contact does not sway with continued usage. The base of the contact is connected...