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Method for package-level integrated electromagnetic absorbing adhesive for RF packaging

IP.com Disclosure Number: IPCOM000132647D
Publication Date: 2005-Dec-28
Document File: 3 page(s) / 26K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for package-level integrated electromagnetic absorbing adhesive for radio frequency (RF) packaging. Benefits include improved functionality and improved performance.

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Method for package-level integrated electromagnetic absorbing adhesive for RF packaging

Disclosed is a method for package-level integrated electromagnetic absorbing adhesive for radio frequency (RF) packaging. Benefits include improved functionality and improved performance.

Background

      Electromagnetic interference problems (EMI) due to the RF packaging must be reduced to improve device performance and signal quality.

              Conventionally, metal shields and metal boxes are introduced to provide a noise barrier (see Figure 1).

      When an RF module operates, it radiates electromagnetic energy. Because the package form factor is large for its thickness, the RF package interferes with other components by radiating through the top. If an electromagnetic absorbing layer is added above the molding compound or above the circuits, the radiated energy is reduced by the absorbing material.

General description

              The disclosed method integrates a thin electromagnetic absorbing adhesive layer with high heat conductivity in the package during the assembly procedure. This electromagnetic adhesive layer contains electromagnetic absorbing material, which absorbs the electromagnetic energy radiated by the RF circuits.

              The key elements of the disclosed method include:

•             Electromagnetic absorbing layer

•             Integrated electromagnetic absorbing adhesive layer

Advantages

              The disclosed method provides advantages, including:
•             Improved functionality due to integrating the EMI absorbing layer in the package

•             Improved functionality due to enabling RF packages to be used without EMI considerations

•             Improved functionality due to enabling reduction of the motherboard size

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