Dismiss
InnovationQ will be updated on Sunday, Oct. 22, from 10am ET - noon. You may experience brief service interruptions during that time.
Browse Prior Art Database

Method for solder-free SMT components with polarity-orientation studs

IP.com Disclosure Number: IPCOM000144793D
Publication Date: 2007-Jan-06
Document File: 4 page(s) / 96K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for solder-free surface mount technology (SMT) components with polarity-orientation studs. Benefits include improved functionality, improved performance, improved environmental friendliness, improved reliability, improved throughput time, and improved cost effectiveness.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 52% of the total text.

Method for solder-free SMT components with polarity-orientation studs

Disclosed is a method for solder-free surface mount technology (SMT) components with polarity-orientation studs. Benefits include improved functionality, improved performance, improved environmental friendliness, improved reliability, improved throughput time, and improved cost effectiveness.

Background

      Surface mount device (SMD) is a type of electronic component package that enables the component to mount on the outer layer of a printed circuit board (PCB). The technology is widely implemented with resistors and capacitors to reduce the space required on PCBs. SMDs have improved performance over through-hole components due to their smaller size, shorter internal leads, and smaller board layouts, especially without using a through-hole component.

However, this technology brings difficulties to component assembly, including the following:

•     Incorrect polarity assembly, especially during manual rework

•     Long rework time for removing the original component and replacing it with another component

•     Specially skilled workers to solder and resolder the tiny components

Description

      The disclosed method is solder-free SMT components with polarity-orientation studs. The method uses a stud-and-tube coupling system to ensure the successful mounting of devices. Female-type positive and negative studs are located on the leg of the SMD component (see Figure 1).

      Male-type positive and negative polarity tube pads are located on the PCB board (see Figure 2).

      The pattern of the studs and tubes ensures components are installed with the correct polarity orientation. Additionally, the coupling system provides a stronger mechanical connection. Conductivity flux can be added on the pad surface before mounting the component to reduce any impedance discontinuity and to enhance the surface contact (see Figures 3 and 4).

      The disclosed method creates a motherboard with a discontinuous contact surface. A possible solution is the use of evenly distributed carbon nanotubes.

      Rework time and cost is reduced with the disclosed method. SMD components are replaced by pulling it out, applyin...