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Method for a leadframe that prevents paste/leadframe delamination

IP.com Disclosure Number: IPCOM000144795D
Publication Date: 2007-Jan-06
Document File: 2 page(s) / 162K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a leadframe that prevents paste/leadframe delamination. Benefits include improved functionality, improved performance, and improved reliability.

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Method for a leadframe that prevents paste/leadframe delamination

Disclosed is a method for a leadframe that prevents paste/leadframe delamination. Benefits include improved functionality, improved performance, and improved reliability.

Background

      Interfaces under high temperature and moisture level are prone to interfacial delamination. The problem is conventionally solved using surface treatments, such as plasma cleaning and brown oxide treatment (see Figure 1).

      Alternatively, surface dimple-like features on the leadframe can reduce delamination. However, sometimes these improvements are insufficient (see Figure 2).

Description

      The disclosed method is a leadframe that prevents paste/leadframe delamination. The method provides strong mechanical interlocking. The leadframe has a pattern with reservoir features. Paste and fluid-like adhesives flow into the reservoir of the leadframe, which provides strong mechanical interlocking and prevents paste/leadframe delamination (see Figure 3).

      The disclosed method can be implemented using the following steps:

1.   Micro-cast or selectively etch a solid leadframe into patterns.

2.   Apply paste or any other fluid-like adhesives onto the leadframe. The adhesive flows into the reservoir. After curing, the adhesive solidifies and forms paw-like structures. ...