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Method for flux application using a stamp pad

IP.com Disclosure Number: IPCOM000145890D
Publication Date: 2007-Jan-30
Document File: 2 page(s) / 111K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for flux application using a stamp pad. Benefits include improved functionality and improved performance.

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Method for flux application using a stamp pad

Disclosed is a method for flux application using a stamp pad. Benefits include improved functionality and improved performance.

Background

      The conventional methods for applying flux to substrates include screen printing and spraying. Due to the required thickness, bump scraping can occur during screen printing, preventing die/substrate connection (see Figures 1 and 2).

      Spray flux is an underdeveloped solution because the spray cannot be contained to the required area.

General description

      The disclosed method is flux application using a stamp pad. The method stamps a predetermined amount of flux onto a substrate.

      The key elements of the disclosed method include:

•     Flux dispensed onto a predetermined-size stamp head on a tool

•     Flux stamped onto the bump area of a substrate

Advantages

      The disclosed method provides advantages, including:
•     Improved functionality due to providing flux application using a stamp pad
•     Improved performance due to enabling improved control of the flux application

Detailed description

      The disclosed method is flux application using a stamp pad. The stamp head can be sponge or another material, such as rubber, plastic, or polytetrafluoroethylene (PTFE), as required for...