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Vacuum-Formed Thin Metal EMI Shield

IP.com Disclosure Number: IPCOM000146369D
Publication Date: 2007-Feb-13
Document File: 2 page(s) / 48K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an EMI shield made from .001 to .003 inch thick sheet metal stock and vacuum formed into a single cavity mold. Benefits include more inner headroom for components under the shield, and no open corners (which is best for containing EMI leakage).

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Vacuum-Formed Thin Metal EMI Shield

Disclosed is a method for an EMI shield made from .001 to .003 inch thick sheet metal stock and vacuum formed into a single cavity mold. Benefits include more inner headroom for components under the shield, and no open corners (which is best for containing EMI leakage).

Background

The typical EMI stamping process (that forms the walls and the final size/shape) tends to distort the top and bottom surfaces of the EMI shield when the thickness goes below .0055 inches. As the material flows through the stamping tool, the thin sheet metal tends to stick to the cutter inserts instead of properly flowing through each station; this binds the material, causing distortion and stopping the stamping process.

To address this problem, the current method keeps materials at or above .0055” inches in thickness. It also holds the stamping rate steady at between 60 and 100 parts per minute, depending on size of the EMI shield. Using a lubricant on the cutting edge of the tooling and pins ensures that the material does not stick.

General Description

The disclosed method creates EMI shields made from .001 to .003 inch thick sheet metal stock and vacuum formed into a single cavity mold. Sheet metal roll stock (made from cold rolled steel, tin plated copper or nickel silver) is fed into a three stage stamping tool. The first s...