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Method for a package with embedded thermal fins

IP.com Disclosure Number: IPCOM000146425D
Publication Date: 2007-Feb-13
Document File: 3 page(s) / 92K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a package with embedded thermal fins. Benefits include improved functionality and improved thermal performance.

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Method for a package with embedded thermal fins

Disclosed is a method for a package with embedded thermal fins. Benefits include improved functionality and improved thermal performance.

Background

      A conventional semiconductor stacked package can have the following components (see Figure 1):

•     4 Dice

•     Package substrate

•     Mold compound

•     Solder balls

      A package usually dissipates heat through the board on which it is mounted and to the surrounding air through its top surface.

      In many designs with dynamic random access memory (DRAM) or flash memory, the packages dissipate heat through the board with little or no cooling airflow or moderate to good airflow. The amount of heat dissipated is usually limited by the convection resistance. It can generally be improved by providing more cooling surface area, such as in the form of fins.

      Transfer molding is one of the most widely used molding processes for semiconductor packaging because of its capability to mold small parts with complex features in high volume.

      Other fin types commonly found in conventional heatsink designs include square-pin type fins and crosscut linear fins (see Figure 2).

General description

      The disclosed method is a package with embedded fins. They surround the sides and top of the die stack. The fins are the same material as the package mold and are formed during the mold process.

Advantages

      The disclosed metho...