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Molded Package with Integrated Heat Sink for an Improved Thermal Solution

IP.com Disclosure Number: IPCOM000146429D
Publication Date: 2007-Feb-13
Document File: 2 page(s) / 107K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that integrates a heat sink into a molded package for an improved thermal solution. Benefits include a solution that can be used in systems with a limited amount of space.

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Molded Package with Integrated Heat Sink for an Improved Thermal Solution

Disclosed is a method that integrates a heat sink into a molded package for an improved thermal solution. Benefits include a solution that can be used in systems with a limited amount of space.

Background

High power and small die size have elevated junction temperatures, and this is especially true in overmolded cases where it is very difficult to dissipate heat from an overmolded package. This makes it very difficult to achieve the junction temperature target. Therefore, an alternative heat path is needed to channel heat away from the package.

In the current state of art, heat is transferred through tiny thermal vias and also through the mold compound, which has low conductivity (see Figure 1). 

General Description

The disclosed method uses the space between the die and package edge to attach a heat sink to provide an alternative path for the heat to escape. A metal mesh is attached on top of the die that connects to the metal heat sink (see Figure 2). There are slots in between the mesh for the mold compound material to flow up and cover the die. The mold compound can be applied at the slots between the heat sink.

To incorporate the heat spreader to the package, a thin layer of thermal interface material (TIM) is applied to the die surface to conduct the heat effect...