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Method for attaching heatpipes across multiple heatsinks on a memory module

IP.com Disclosure Number: IPCOM000146639D
Publication Date: 2007-Feb-19
Document File: 2 page(s) / 46K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for attaching heatpipes across multiple heatsinks on a memory module. Benefits include improved functionality, improved thermal performance, and improved performance.

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Method for attaching heatpipes across multiple heatsinks on a memory module

Disclosed is a method for attaching heatpipes across multiple heatsinks on a memory module. Benefits include improved functionality, improved thermal performance, and improved performance.

Background

      Conventional methods for cooling memory modules include thin sheet-metal plates attached to a memory module using rivets or clips. Future memory modules are expected to require larger heatsinks to adequately cool the dynamic random access memory (DRAM) chips on the module. Hard attachment of the heatsinks using rivets or screws can create forces on the individual DRAMs that can damage the DRAM or the solder balls that join the DRAM to the memory module.

      Multiple heatsinks are conventionally attached to a memory module using a wire spring device. It does not share the thermal load between the heatsinks (see Figure 1).

Description

      The disclosed method attaches heatpipes across multiple heatsinks on a memory module. A heatpipe runs down the center of the heatsinks to transfer heat from the hottest heatsinks to the cooler heatsinks (see Figure 2).

      The method disperses the thermal load from one component to multiple heatsinks. The method enables the thermal solution to take advantage of greater cooling in one area of the memory modu...