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Method for a heatsink leaf spring for compliant heatsink attachment

IP.com Disclosure Number: IPCOM000146640D
Publication Date: 2007-Feb-19
Document File: 2 page(s) / 46K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a heatsink leaf spring for compliant heatsink attachment. Benefits include improved functionality, improved thermal performance, and improved reliability.

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Method for a heatsink leaf spring for compliant heatsink attachment

Disclosed is a method for a heatsink leaf spring for compliant heatsink attachment. Benefits include improved functionality, improved thermal performance, and improved reliability.

Background

      Conventional methods for cooling memory modules include thin sheet-metal plates attached to a memory module using rivets or clips. Future memory modules are expected to require larger heatsinks to adequately cool the dynamic random access memory (DRAM) chips on the module. Hard attachment of the heatsinks using rivets or screws can create forces on the individual DRAMs that can damage the DRAM or the solder balls that join the DRAM to the memory module.

      Conventional heatsink attachment does not provide for compliant attachment for different height DRAMs on a memory module. Conventional solutions are hard attached using a clip or screw and apply uneven pressure to different height memory components and can cause component failure.

Description

      The disclosed method is a heatsink leaf spring for compliant heatsink attachment. The method eliminates the stress on the DRAM chip by enabling individual compliance for the heatsink attachment to the DRAM chip.

      The heatsink(s) are attached to a memory module using a hard mechanism, such as a screw or rive...