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Airflow bypassing on Blade products

IP.com Disclosure Number: IPCOM000166919D
Original Publication Date: 2008-Jan-28
Included in the Prior Art Database: 2008-Jan-28
Document File: 1 page(s) / 247K

Publishing Venue

IBM

Abstract

Disclosed is a new cooling method using Airflow bypassing on blade products. It can enable to lower the temperature of inner electrical components and exhaust air by catching, splitting and bypassing fresh airflow in the front of such blades.

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Airflow bypassing on Blade products

Blade products have highly dense components placement within their enclosure. In general, electrical components in the inner row (or airflow-downstream area) receive heat from the CPU-exhausted hot air, but must get cooled. These components also make the airflow temperature hotter and exhaust outside of blade enclosure. Thermal solution is not easy to satisfy both requirements of efficient cooling and lower air exhaust temperature.

     A new method of Airflow bypassing for blade products is shown in the figure. The airflow bypass is made by getting open space in the width-reduced CPU heat sink behind the perforated front cover. The airflow bypass enables to route fresh air partially into the inside along with the gap between the heat sink and the enclosure side wall. That can effectively cool of inner electrical components cooler behind the front row heat sink by receiving fresh air partially. Also it can lower the temperature of exhaust air toward the enclosure's outlet by airflow mixed with fresh air.

Airflow of Blade products (Top), Airflow w/ Bypassing (Left), and w/o Bypassing (Right)

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