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Power module cooling optimization through power and thermal metering

IP.com Disclosure Number: IPCOM000171715D
Original Publication Date: 2008-Jun-17
Included in the Prior Art Database: 2008-Jun-17
Document File: 3 page(s) / 33K

Publishing Venue

IBM

Abstract

Optimize power module cooling capacity by monitoring power draw and critical chassis thermal statistics outside of power module.

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This is the abbreviated version, containing approximately 53% of the total text.

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Power module cooling optimization through power and thermal metering

In server environments, the power modules in the chassis provide power to the system. Typically as power demand goes up, the power module will heat up as well. Other factors such as inlet temperature and if there are any blockages will affect the power module internal temperature. Power demand changes faster than the power module's overall temperature, so a fast reacting method is desired. Monitoring both the power module temperature sensors, inlet and exhaust, and the power demand via power module power meter provide fast reaction time and allow the power module to be cooled at the lowest safe speed to ensure proper operation. Disclosed is an algorithm to optimize power module fan speeds in order to run them at the lowest speed that provides the proper cooling for its components.

     The Advanced Management Module (AMM) has access to a sensor that reads the ambient temperature and pressure for the system's environment. It can then go and read the power modules' inlet, exhaust and power meter values. Based on the power module temperatures and the power demand power reading, the AMM can use an algorithm to set the cooling device speeds to the lowest value that will allow the power module to properly cool the power module.

     When power demand changes dramatically, thermal mass will prevent certain components of the power module from heating quickly and a purely temperature driven thermal solution will lag in cooling the device. The power demand changes very quickly and the cooling device in the power module can be used to ramp the fans as the smaller thermal massed objects in the power module heat, and in anticipation of the larger massed components in the power module heating up. This prevents certain components from reaching high temperatur...