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Method and device to optimally retain a heatsink

IP.com Disclosure Number: IPCOM000171721D
Original Publication Date: 2008-Jun-17
Included in the Prior Art Database: 2008-Jun-17
Document File: 1 page(s) / 27K

Publishing Venue

IBM

Abstract

Given the increasing heat output from today's processors and other integrated circuits of high density, it has become highly important to properly place and maintain heat sink devices capable of dispersing the heat coming from these chips in a way that can easily be removed by cooler air flow. In order to comply with proper placement and pressure, current methods for heat sink retention tend to occupy a large area of real estate on the system board. This article covers an implementation in the server environment that moves this burden from the system board to the chassis.

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Method and device to optimally retain a heatsink

The idea is to attach a lever arm to one of the sides of the server chassis by using a hinge that allows the arm to rotate. The arm contains a number of spring-loaded contacts placed in an arrangement that allows them to push down upon the heat sinks that are being retained. The opposite side of the system chassis will contain a latch that will hold the arm in place when in its closed position.

     When the arm latches over top of the heat sinks, there will be enough pressure to both keep the devices from moving and keep them pressed against the chips that they are meant to cool. This pressure is very important to ensure proper heat transfer between the chip being cooled and the heat sinks. The figure below illustrates the design.

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