Browse Prior Art Database

New IC Package - Bottle Type Method

IP.com Disclosure Number: IPCOM000172206D
Published in the IP.com Journal: Volume 8 Issue 7B (2008-07-25)
Included in the Prior Art Database: 2008-Jul-25
Document File: 1 page(s) / 21K

Publishing Venue

Siemens

Related People

Juergen Carstens: CONTACT

Abstract

At present, for most of surface mount IC (Integrated Circuit) packages carrier and cover tapes are used when the chips are to be shipped to the customer. Using these tapes increases the chip packing costs. Other current solution include trays or tubes which, however, are more suitable to large packages like PGA (Pin Grid Array) or BGA (Ball Grid Array) in case of trays or DIP (Dual Inline Package) in case of tubes.

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New IC Package - Bottle Type Method

Idea: Lim Tian Hing, CN-Wuxi; Soh Yuen Chun, CN-Wuxi

At present, for most of surface mount IC (Integrated Circuit) packages carrier and cover tapes are used when the chips are to be shipped to the customer. Using these tapes increases the chip packing costs. Other current solution include trays or tubes which, however, are more suitable to large packages like PGA (Pin Grid Array) or BGA (Ball Grid Array) in case of trays or DIP (Dual Inline Package) in case of tubes.

A novel solution to the problem mentioned above is presented in the following. Instead of using tapes, a bottle can be placed at the output of a test handler and good units can be dropped into the bottle (Figure 1). The bottle size can be designed according to the customers needs. This bottle can subsequently be used at the EMS (Electronic Manufacturing Services) customer site to fill the units into a vibrator bowl from where the units are conveyed to a pick and place site (Figure 2).

The advantages of the presented solution are among others that the chip packing costs can be reduced and that the packing and transportation process can be simplified. Also, the bottle packing may be recyclable.

Figure 1: Bottle at the manufacturer site

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Figure 2: Bottle at the customer site

Bottle

© Infineon Technologies 2008 file: ifx_200...