Browse Prior Art Database

Integrate IC Chips and Passives Components with TSV for SiP

IP.com Disclosure Number: IPCOM000174770D
Original Publication Date: 2008-Oct-13
Included in the Prior Art Database: 2008-Oct-13
Document File: 1 page(s) / 421K

Publishing Venue

Siemens

Related People

Juergen Carstens: CONTACT

Abstract

A SiP (System-in-Package) is an application specific IC package (IC: Integrated Circuit) comprising one or more IC chips with optional passive components such as discrete passives or SAW filters (SAW: Surface Acoustic Wave). SiP is achieved by putting together the different individual IC-components with passive components side by side on a substrate. The substrate can be BT-epoxy (BT: Bismaleimide-Triazine) or a similar class of material. The various IC and passive components are interconnected to the substrate by means of conductive traces. These interconnections are realized through wire bonding or flip chip technologies. A combination of both is possible too. As the different individual IC components are putted side by side on the substrate, it causes a large expanse of the package. Thus, it represents a problem for mobile applications. Also, the way of interconnection of passive components with conductive traces on the substrate causes long electrical paths and high power consumption. Additionally, this makes it disadvantageous for mobile products.

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Integrate IC Chips and Passives Components with TSV for SiP

Idea: Kimyung Yoon, DE-Dresden

A SiP (System-in-Package) is an application specific IC package (IC: Integrated Circuit) comprising one or more IC chips with optional passive components such as discrete passives or SAW filters (SAW: Surface Acoustic Wave). SiP is achieved by putting together the different individual IC- components with passive components side by side on a substrate. The substrate can be BT-epoxy (BT: Bismaleimide-Triazine) or a similar class of material. The various IC and passive components are interconnected to the substrate by means of conductive traces. These interconnections are realized through wire bonding or flip chip technologies. A combination of both is possible too. As the different individual IC components are putted side by side on the substrate, it causes a large expanse of the package. Thus, it represents a problem for mobile applications. Also, the way of interconnection of passive components with conductive traces on the substrate causes long electrical paths and high power consumption. Additionally, this makes it disadvantageous for mobile products.

The following new solution mounts optional passive components directly on the top of an IC chip (Figure 1) or interposer (Figure 2) instead of attaching it side by side. For this application the co...