Ceramic Block Cleaning Using Micro Bubbles
Publication Date: 2009-Feb-09
The IP.com Prior Art Database
Venugopal Krishnan: AUTHOR [+2]
Ceramic Blocks are being cleaned before sending to wafer mounting process. The existing cleaning process takes place by using ultrasonic method. Implemented method uses micro bubble generators to clean block surface in better way and also helps to reduce energy significantly.
CERAMIC BLOCK CLEANING USING MICRO BUBBLES
Venugopal Krishnan & Gordon McKee
Siltronic Singapore Pte. Ltd.
Ceramic Blocks are being cleaned before sending to wafer mounting process. The existing clean- ing process takes place by using ultrasonic method. Implemented method uses micro bubble gen- erators to clean block surface in better way and also helps to reduce energy significantly.
Ceramic Blocks have to be cleaned before mounting wafers on the surface. Cleaning process is done in bath filled tank with the help of ultrasonic generators to remove micro particles and dirt stick on the block surface. Ceramic blocks are dipped in bath that is the mixture of DI water and surfactant. By using ultrasonic generators vibration is created together with the oscillation of blocks up and down the cleaning takes place. After few minutes of cleaning process, the blocks are sent for wafer mounting. Use of Ultrasonic method is found not highly efficient to remove micro particles or dirt of block surface. Thus the inefficient cleaning affects the wafer quality due to high real dim- ple issue. Also ultrasonic method consumes huge electricity energy. Also there are some chances of damaging the block surface after certain period of time.
This concept uses two Micro bubble generators which are dipped in bath. Bubble generator breath with air inlet port provided there with constant amount of air supplied to it. Together with ELMA sur- factant it produces micro bubbles and thus the circulation is done by pneumatic pump. This way of cleaning by micro bubble is tested and the result shows much improvement in block surface clean- ing. Better cleaning helps to overcome real dimple issue on wafer quality. Also by implementing micro bubble cleaning method, huge amount spend on electricity is avoided. In addition the surfac- tant amount also reduced and cost saved.
BENEFITS OF MICROBUBBLE v ULTRASONIC
● Lower Chemical Costs (reduced ELMA f...