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A Universal Packaging System for Integrated Downhole Electronics

IP.com Disclosure Number: IPCOM000179717D
Publication Date: 2009-Feb-24
Document File: 2 page(s) / 57K

Publishing Venue

The IP.com Prior Art Database

Abstract

This packaging method is applicable for typical integrated electronics (i.e. circuit boards) located in the air section of downhole tools. In this packaging system, the target circuit board are immersed in an inert protection medium (for example, viscous liquid or gel) in a sealed container. The boards are floated in the medium and the circuit is connected to outside via electrical wires and connector(s).

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