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A Novel HSSI Wire Bond Scheme To Reduce High Density Wire Bond Transceiver Interconnect Cross-Talk

IP.com Disclosure Number: IPCOM000187761D
Publication Date: 2009-Sep-18
Document File: 4 page(s) / 116K

Publishing Venue

The IP.com Prior Art Database

Abstract

Place receiver and transmitter die pad pairs in-line on outer die pad row with ground pad shielding each of receiver and transmitter pair. Place transceiver power and ground pads on inner die pad row Assign receiver fingers on first tier along with shielding ground wires Assign transmitter fingers on second tier along with shielding ground wires

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A Novel HSSI Wire Bond Scheme To Reduce High Density Wire Bond Transceiver Interconnect Cross-Talk

3.      Summarize the invention in the following provided space:

A novel wire bond pad placement and finger arrangement for high density wire bond transceiver package to achieve minimum loss and cross talk.

  • Place receiver and transmitter die pad pairs in-line on outer die pad row with ground pad shielding each of receiver and transmitter pair.
  • Place transceiver power and ground pads on inner die pad row
  • Assign receiver fingers on first tier along with shielding ground wires
  • Assign transmitter fingers on second tier along with shielding ground wires

4.      Summarize what has been done before in the following provided space:

  • Receiver and transmitter die pad pairs in-line placement without shielding ground pads
  • Receiver and transmitter fingers are all on the same tier
  • No coupling or shielding ground wires between receiver wires and transmitter wires

5.      Describe the problem(s) you are trying to solve in the following provided space:

Performance degradation associated with loss and cross-talk has been the major concern with high density wire bond transceiver packages. Return loss and insertion loss are function of wire length while cross-talk is strongly related to wire to wire space. For high IO density wire bond transceiver package, wire length and wire space must be properly balanced.

It is desirable to have all receiver/transmitter wires as short as possible to reduce loss. However, as number of transceiver channels increase, closely packed wires will be unavoidable. Closely coupled wires will lead to high cross talk between wires.

Pulling transceiver wires out will help separate the wire to wire space. The result will be a much longer wire length which gives much higher return loss and insertion loss.

6.      Summarize the advantage(s) and/or value(s) in the following provided space:

  • Having shield ground die pads on each side of receiver and transmitter die pad pairs allows proper wire to wire space between receiver pair and transmitter wire pair from silicon die first bond to package substrate finger second bond to ensure adequate cross-talk performance.
  • Shielding ground wires that having the same wire loop as the receiver or transmitter wires serve as return current loop for the transceiver signal and thus reduce the overall inductance.
  • Prioritizing receiver and transmitter wire lengths allows better balance between wire length and wire-to-wire space and meeting overall package electrical specification.
  • Setting different receiver and transmitter wire lengths will place receiver wire and transmitter wire in different loop height and thus separate receiver wire and transmitter wire further apart.

 

7.      Attach a detail description of the invention, the description should:

a.                   Describe how the prior art wo...