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Detecting imperfection in wafers using electromagnetic wave

IP.com Disclosure Number: IPCOM000189042D
Original Publication Date: 2009-Oct-26
Included in the Prior Art Database: 2009-Oct-26
Document File: 2 page(s) / 40K

Publishing Venue

IBM

Abstract

Disclosure is a semiconductor process technology. It describes a novel ideal to detect imperfections inside semiconductor wafers.

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Detecting imperfection in wafers using electromagnetic wave

Disclosure is a semiconductor process technology. It describes a novel ideal to detect imperfections inside semiconductor wafers. The imperfections includes but not limits to chipping, crack, bite and etc. The location of the imperfections could be on the surface of the wafer or inside the body of the wafer.

The imperfections inside the body of the wafer are not typically visible to optical detection methods. This disclosure presents a technique to detect them. The technique can also detect imperfections on the surface of the wafer. It has a waveguide apparatus which holds the wafer. An electromagnetic wave is injected into the apparatus. The wave travels through the apparatus and wafer edge before it exits from another end of the waveguide. A detector is used to sense the characteristics of the wave, such as amplitude and phase. When an imperfection is in the wave path, the characteristics of the wave are be distorted. The characteristics of the input and output waves are compared to determine if imperfections are encountered in the path of the wave.

The apparatus could be a stand alone tool or integrated with the wafer container. The conductor layer 1 and 2 are about 10 um thick, made of highly conductive materials such as copper. The insulator encapsulation is made of highly resisti...