Browse Prior Art Database

Pluggable Module Thermal Sensors with Power Optimization

IP.com Disclosure Number: IPCOM000191735D
Original Publication Date: 2010-Jan-13
Included in the Prior Art Database: 2010-Jan-13
Document File: 4 page(s) / 125K

Publishing Venue

IBM

Abstract

Disclosed is a pluggable electronic module with upstream and downstream thermal sensors without regard to module orientation. The module can detect the orientation by comparing temperature differences and can then enable thermal control based on temperature and rate of change of temperature using both upstream and downstream measurements.

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Pluggable Module Thermal Sensors with Power Optimization

Disclosed is a pluggable electronic module with a plurality of thermal sensors which can detect incoming air temperature as well as outgoing air temperature, regardless of which end of the module is facing incoming airflow. The module also provides a logic device to obtain each of the thermal sensors readings. The logic device uses this information to determine the orientation of the module within the airstream. It also calculates if critical thermal boundaries have been crossed and takes action by communicating with external components to resolve the critical temperatures. Further, the logic will track the temperatures and the rate of change of the temperatures to delay as long as practical commands to expend more energy to cool the module.

Because all the logic to read the sensors and make decisions is local to the pluggable module which is being thermally controlled, the latency in obtaining the information is reduced. This reduced latency will allow greater energy savings in delaying the engagement of the cooling system because it can be controlled with tighter tolerances.

Current industry standard pluggable electronic modules such as a registered Dual Data Rate 2 (DDR2) Dual In Line Memory Module (DIMM) do not have thermal sensors. Other modules such as Fully Buffered DIMMs (FB-DIMM) have a thermal sensor in the central buffer. DDR3 modules have a centrally located thermal sensor not in the central buffer. Both the FB-DIMM and DDR3 DIMM provide thermal sensing in the central region with inherent lack of accuracy to represent the most extreme temperatures at the most downstream components. The module of this disclosure resolves this deficiency.

It is typical due to physical placement, wiring and thermal requirements across multiple platforms for DIMMs to not all be placed in the same orientation, so it is not acceptable to have thermal sensors at only one extreme position of th DIMM because in some cases the thermal sensor will be at the inlet air temperature and providing little useful information regarding module cooling needs. The disclosed module resolves this problem.

A more detailed description of a preferred embodiment of the disclosed module follows.

Figure 1 shows a registered DIMM or prior art without a thermal sensor.

Figure 2 shows a newly proposed registered DIMM or prior art with a single thermal sensor inside the Serial Presence Detect (SPD) device with the SPD centrally located in the DIMM.

Figure 3 shows an embodiment with two System Ma...