Browse Prior Art Database

Low Cost Enhancement to Anti-Recirclation Flaps

IP.com Disclosure Number: IPCOM000193804D
Publication Date: 2010-Mar-09
Document File: 3 page(s) / 274K

Publishing Venue

The IP.com Prior Art Database

Abstract

Described is an invention that relates generally to cooling systems for electrical component enclosures and, in particular, to a method and apparatus to enhance the prevention of flow recirculation leakage around flap-type devices during extraction of air moving device or other electrical components within an enclosure.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 53% of the total text.

Page 1 of 3

Electronic system enclosures may include cooling systems to regulate the temperature of their electrical components. One type of cooling system is a forced air system that relies on a plurality of air movers to blow air over the electrical components in order to cool the components. When a component is removed, for example in the array of Hard Disk Drives (HDDs) pictured in Figure 1, the airflow path through the vacant HDD carrier in any position can become a free path for air movement into the front of the system or out the back depending on which side of the system's Air Moving Device (AMDs) it is removed from as illustrated in Figure 2.

Ȉ ˇ ˄ Ȉ ˇ ˙

    The system does incorporate flappers, illustrated in Figure 3, which activate (in this case the flap springs into an upright position) upon the removal of a DASD Carrier. However, due to the high pressurization of the system, even the small gaps which exists between the flap and the internal walls allow significant airflow to leak past and short circuit adjacent DASD Carriers.

Ȉ ˇ ˝

    Possible corrective measures are the insertion of a blockage of some kind, insertion of additional imbedded flaps within the enclosure, either mechanically, pneumatically or gravity activated, which hinge or expand to fill more of the voids. The effectiveness of such flaps depend on the percentage to which it fills the void and the impedance they impose on any leakage of airflow between the void in the enclosure and the flaps. This concept identifies one possible, low-cost enhancement to block off the gaps left between the flaps and the enclosure while avoiding tolerance fits without requiring additional space within the enclosure.

    Since the flap itself cannot be molded with tighter tolerances to assist in closing the gaps, another physical attribute must be added to the design which will fill the gaps without imposing tolerance or clearance issues. One such attribute is to a...