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Method and System of Cooling RX/Poly Resistors using a Body-Tie Structure and a Metal Interconnect Mesh

IP.com Disclosure Number: IPCOM000197768D
Publication Date: 2010-Jul-21
Document File: 2 page(s) / 60K

Publishing Venue

The IP.com Prior Art Database

Abstract

A method and system is provided to cool RX/poly resistors using a body-tie structure and a metal interconnect mesh.

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Method and System of Cooling RX/Poly Resistors using a Body-Tie Structure and a

Metal Interconnect Mesh

Disclosed is a method and system for cooling body, silicon, or polysilicon resistors using a body-tie structure and a metal interconnect mesh. The method and system involves creating an M1 mesh conductor over the body of a resistor connected to a body-tie structure as illustrated in the figure. The M1 mesh conductor acts as a heat sink to cool the RX/poly resistors.

Figure

Thus, the method and system cools RX/poly resistors using the body-tie structure and the M1 mesh conductor. The M1 mesh conductor uses metal films in order to achieve higher thermal conductivity. Further, the use of the M1 mesh conductor versus an M1

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plate makes manufacturing of the structure easier.

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